PCB Partner knows that there are many options concerning base materials and with our technical knowledge we can help guide and assist you in terms of material selection and material specifications.
Rigid material
How should material be specified?
Every well-known manufacturer of material will have their product categorized in accordance with IPC 4101 (specification for base materials for rigid and multilayer printed boards) with the aim of this specification being to identify and categorize performance characteristics. Using this categorization approach is ideal as it defines the characteristics of the base material, in detail, and allowing the factory to follow the IPC-4101-xxx categorization enables them to select wisely thus ensuring performance is nothing less than expected.
If you you wold like more information on IPC 4101 or material specification methods, then please contact PCB Partner who will be happy to help.
Key factors in specifying material characteristics
When considering the performance characteristics of the base material, consideration should be given to both the mechanical properties (specifically in relation to how the material shall perform during heat cycling / soldering operations) and also the electrical properties associated with the material. These are typically regarded as the most common factors for selection of standard products. This comment is based upon all material being considered able to meet UL flammability rating V”0.
Key material characteristics
· CTE – Z axis (Co-efficient of thermal expansion): This is a measure of how much the base material will expand when heated. Measured as PPM/degree C (both before and after Tg) and also in % over a temperature range.
· Td (Decomposition temperature): This is the temperature at which material weight changes by 5%. This parameter determines the thermal survivability of the material.
· Tg (Glass transition temperature): The temperature at which the material stops acting like a rigid material and begins to behave like a plastic / softer.
· T260 (Time to delamination): This is the time it take for the base material to delaminate when subjected to a temperature of 260 degrees C.
· T288 (Time to delamination): This is the time it take for the base material to delaminate when subjected to a temperature of 288 degrees C.
· Dk (Dielectric constant): The ratio of the capacitance using that material as a dielectric, compared to a similar capacitor which has a vacuum as its dielectric.
· CTI (Comparative tracking Index): A measure of the electrical breakdown properties of an insulating material. It is used for electrical safety assessment of electrical apparatus. Rating can be seen below.
Tracking Index (V) |
PLC |
600 and greater |
0 |
400 through 599 |
1 |
250 through 399 |
2 |
175 through 249 |
3 |
100 through 174 |
4 |
< 100 |
5 |
The table below is an extract of certain characteristics from IPC-4101 classifications, highlighting some of the details already referenced.
IPC-4101 |
99 |
101 |
121 |
124 |
126 |
127 |
128 |
129 |
130 |
Tg (min) C |
150 |
110 |
110 |
150 |
170 |
110 |
150 |
170 |
170 |
Td (min) C |
325 |
310 |
310 |
325 |
340 |
310 |
325 |
340 |
340 |
CTE Z 50-260 C |
3,5% |
4% |
4% |
3,50% |
3% |
4% |
3,50% |
3,50% |
3% |
T260 (min) minutes |
30 |
30 |
30 |
30 |
30 |
30 |
30 |
30 |
30 |
T288 (min) minutes |
5 |
5 |
5 |
5 |
15 |
5 |
5 |
15 |
15 |
Fillers > 5% |
Yes |
Yes |
NA |
NA |
Yes |
Yes |
Yes |
NA |
Yes |
Dk/Permittivity (max) |
5,4 |
5,4 |
5,4 |
5,4 |
5,4 |
5,4 |
5,4 |
5,4 |
5,4 |
Insulated Metal Substrate (IMS) – effective technology for heat dissipation
New opportunities with insulated Metal Substrate
For greater amounts of energy or local thermal loads, e.g in modern constructions with high intensity LEDS, IMS technology can be used. The abbreviation, IMS, stands for “Insulated Metal Substrate.” This is a PCB built on a metal plate – normally aluminium – on which a special prepreg is applied, the primary qualities of which are an excellent capacity for heat dissipation and great dielectric strength against high voltages. Together with EBV and a number of other companies, NCAB has taken part in the development of a demo product. The aim here is to attract the market´s attention to the opportunities for combining high intensity LEDs with IMS technology.
The most important constituent – the heat-conducting prepreg – is a ceramic or boron-filled material, specially produced to be able to dissipate large amounts of heat. Its heat conductivity is often 8-12 times greater than that of an FR4.
The advantages of IMS PCBs for heat dissipation
An IMS PCB can be designed with a very low thermal resistance. If, for example, you compare a 1.60 mm FR4 PCB to an IMS PCB with a 0.15 mm thermal prepreg, you may well find the thermal resistance is more than 100 times that of the FR4 PCB. In the FR4 product it would be very difficult to dissipate any larger amount of heat.
TO THINK ABOUT:
When considering the performance characteristics of the base material, consideration should be given to both the mechanical properties (specifically in relation to how the material shall perform during heat cycling / soldering operations) and also the electrical properties associated with the material.
If you have any specific questions about base materials, please contact PCB Partner.
Material recommendations
Material recommendations for different conditions and technologies can be seen below. However it is important to note that they should be viewed as very “rough” recommendations. Equally, we recommend that the customer evaluate their process and define the factors that the materials are required to withstand, such as peak temperature and take into account the demands for Td, T260 and T288.
Materials according to IPC 4101/121 (min. Tg 130 Deg. C)
Total thickness |
≤ 1.60mm |
Number of layers |
1 to 4 |
Copper |
< 70µm |
Material according to IPC 4101/99 or /124
Total thickness |
≤ 2.40mm |
Number of layers |
6 to 12 |
Copper |
≤ 70µm |
Blind / Buried vias / µvias |
|
Material according to IPC 4101/126 or /129
Total thickness |
>2.40mm |
Number of layers |
12+ |
Copper |
> 70µm |
Blind / Buried vias / µvias |
|